![]() – DeltaProbe ready for reflow oven performance monitoring. – Professional software tools including profile analysis and simulation, ISO documentation and integrated SPC management software. – WaveShuttle Pro ready for advanced wave soldering analysis. – Unique SmartLink connection system provides easy and flexible connection to a range of products and accessories. – Up to 12 measurement channels for profiling of the most complex PCB assemblies. – SLX datalogger provides industry-leading accuracy, slim-line footprint and full lead-free thermal performance. This easy to use system is ideal for manufacturers and EMS providers who profile periodically to form a complete mass soldering quality control tool. The reflow oven is used primarily for the reflow soldering of surface mount electronic components to printed circuit boards (PCB). Automatic reflow profile for Tin Bismuth Silver (Sn42 Bi57.6 Ag0.4) Soak Temp. A comprehensive suite of full-feature software includes profile simulations and integrated SPC charting tools. ‘SmartLink’ allows high measurement channel configurations, while maintaining a small footprint and connection to a range of accessories for capture of SPC information from both reflow and wave soldering processes. Maximum roll size Print Pump Head: ALPHA OM-5100 is suitable for use in both MPM RheoPump and DEK. Speed: 25mm to 150 mm (1 Paste Roll: 1.5 to 2.0 cm (0.6 to 0.8 inch) diameter and make additions when roll reaches 1 -cm (0.4 in.) diameter. The SolderStar Pro includes the ultra compact Neptune SL datalogger with unique ‘SmartLink’ connector system. Pressure: 0.15 to 0.3 kg per cm (0.8 to 1.5 pounds per linear inch) of squeegee length. I will check all of this again, very annoying situation.Designed for manufacturers and EMS providers looking for the ultimate in temperature profiling, the SolderStar Pro package takes profiling capability to the highest level and provides true process profiling for optimum quality control. Also, I have the same resistor in several locations on the board, if it was a placement pressure problem I would see the same on all. I suspected the placement pressure, but I don't want to push too much as resistors break. Reflow Profiles: Leaded & Unleaded Solder. Funny, while this is happening with 0805 resistors, I have on the same board 2 tantalum caps size D placed quite close to each other in parallel and one of the pads is connected to a large shield surface without thermal relief, never had any problem with them. The Worlds First Low Temp & Thermal Profile Approach to the Electronic Bench. The thermal mass of the pads, at least where this phenomena happens is equal. The machine placements are very precise and each board is inspected before reflow. solder lead-free parts must also be identified as to avoid cross contamination with leaded solder, which may also be used in close proximity. But you mentioned very logical causes and there is some thinking to do, in addition to the possible bad ENIG plating. Typical reflow profile used with lead-free SAC and SnAg alloys Kester Lead Free Reflow Profile Alloys: Sn95.8/Ag3.5/Cu0.7 and Sn96.5/Ag3.5 0 50 100 150 200 250 300. In most places it is associated to poor wetting, while tombstone is commonly associated with uneven pads or one pad connected to a large surface without thermal relief. Temperature measurement point: Package upper surface (Resin surface) 2. Resistance to soldering heat condition for Package ( Reflow method) Remark. Please contact our sales representatives for details. Thanks wraper, I read a lot about possible causes to this problem, can say for sure that although it looks the same there is a difference between tombstoning and what I am describing. The following figure is an example of a standard package.
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